The technology, on display at Xerox’s Palo Alto Research Center,
or PARC, is part of a new system for making electronics, one that takes
advantage of a Xerox invention from the 1970s: the laser printer.
If perfected, it could lead to desktop manufacturing plants that “print”
the circuitry for a wide array of electronic devices — flexible
smartphones that won’t break when you sit on them; a supple,
pressure-sensitive skin for a new breed of robot hands; smart-sensing
medical bandages that could capture health data and then be thrown away.
The chiplets can be both microprocessors and computer memory as well as
the other circuits needed to create complete computers. They can also be
analog devices known as microelectromechanical systems, or MEMS, that
perform tasks like sensing heat, pressure or motion.
The new manufacturing system the PARC researchers envision could be used
to build custom computers one at a time, or as part of a 3-D printing
system that makes smart objects with computing woven right into them.
The technology is still in the future. The researchers are years from
simultaneously placing tens or hundreds of thousands of circuits
accurately in a fraction of a second. And they acknowledge that this
would be only the first step in designing a commercially viable system.
The emerging printing technology poses a heretical idea: Rather than
squeezing more transistors into the same small space, why not smear the
transistors across a much larger surface?
Moreover, the research could have tremendous economic consequences —
feeding the emergence of a new digital era in manufacturing, much as
laser printing transformed publishing three decades ago.
By replacing the circuit boards now assembled in factories, the
technology would vastly compress a supply chain that spans the globe and
employs hundreds of thousands of workers.
It is one of a variety of technologies related to 3-D printers, which have captured the public’s imagination, raising the specter of homemade manufacturing of everything from tools to guns.
“Digital fabrication will allow individuals to design and produce
tangible objects on demand, wherever and whenever they need them,” Neil
Gershenfeld, a physicist who directs the Center for Bits and Atoms at M.I.T., wrote in December in the journal Foreign Affairs.
While there has already been an explosion in 3-D printing of solid and
mechanical objects both for prototyping and increasingly for small
production runs, PARC’s scientists believe that there will also
ultimately be an ensemble of manufacturing technologies that seamlessly
blend microelectronics with mechanical components.
“You can print mechanical objects, but a lot of things in the world today are more than mechanical,” said Stephen Hoover,
PARC’s chief executive. “A lot of the opportunities we’re going to find
in the ‘Internet of things’ are going to be about how to embed
intelligence at very low cost in a distributed way into the world.”
Source: NYtimes.
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